Book of Donmon Teith

With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits o

The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical en

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,

The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In