Book of Donmon Teith

A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly pro

Of the Standard NuBGA Packages -- Thinner Substrate and Nonuniform Heat Spreader NuBGA -- Thermal Performance of the New NuBGA Package -- Temperature Distributi

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its i

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in inte