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Language: en
Pages: 454
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Type: BOOK - Published: 2002 - Publisher: American Society of Mechanical Engineers
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor i
Language: en
Pages: 432
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Type: BOOK - Published: 1995-10-03 - Publisher: Wiley-Interscience
A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . . Here is the only available comprehensive treatment o
Language: en
Pages: 953
Pages: 953
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly comple
Language: en
Pages: 526
Pages: 526
Type: BOOK - Published: 2009-12-17 - Publisher: CRC Press
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In
Language: en
Pages: 184
Pages: 184
Type: BOOK - Published: 2016-06-15 - Publisher: BoD – Books on Demand
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coola