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2007 12th International Symposium on Advanced Packaging Materials : Processes, Properties, and Interfaces ; San Jose, CA 3-5 October 2007
Language: en
Pages:

2007 12th International Symposium on Advanced Packaging Materials : Processes, Properties, and Interfaces ; San Jose, CA 3-5 October 2007

Authors: International Symposium on Advanced Packaging Materials
Categories: Electronic packaging
Type: BOOK - Published: 2007 - Publisher:

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2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
Language: en
Pages: 132

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces

Authors: Components, Packaging, and Manufacturing Technology Society
Categories: Electronic packaging
Type: BOOK - Published: 2007 - Publisher:

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Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
Language: en
Pages:

Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on

Authors:
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Type: BOOK - Published: 2010 - Publisher:

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2007 12th International Symposium on Advanced Packaging Materials
Language: en
Pages: 130

2007 12th International Symposium on Advanced Packaging Materials

Authors:
Categories: Technology & Engineering
Type: BOOK - Published: 2007-01-01 - Publisher: IEEE Computer Society Press

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Handbook of Wafer Bonding
Language: en
Pages: 435

Handbook of Wafer Bonding

Authors: Peter Ramm
Categories: Technology & Engineering
Type: BOOK - Published: 2011-11-17 - Publisher: John Wiley & Sons

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The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding a