Book of Donmon Teith

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model acco

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the c

This book discusses and compares several new trends that can be used to overcome Moore’s law limitations, including Neuromorphic, Approximate, Parallel, In Me

Postphenomenology and Media: Essays on Human–Media–World Relations sheds light on how new, digital media are shaping humans and their world. It does so by u

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel techni