Electronic Packaging and Interconnect Technology Working Group Report (IDA/OSD R & M (Institute for Defense Analyses/Office of the Secretary of Defense Reliability and Maintainability Study).
| Author | : R. J. Clark |
| Publisher | : |
| Total Pages | : 103 |
| Release | : 1983 |
| ISBN-10 | : OCLC:227604910 |
| ISBN-13 | : |
| Rating | : 4/5 ( Downloads) |
Book Synopsis Electronic Packaging and Interconnect Technology Working Group Report (IDA/OSD R & M (Institute for Defense Analyses/Office of the Secretary of Defense Reliability and Maintainability Study). by : R. J. Clark
Download or read book Electronic Packaging and Interconnect Technology Working Group Report (IDA/OSD R & M (Institute for Defense Analyses/Office of the Secretary of Defense Reliability and Maintainability Study). written by R. J. Clark and published by . This book was released on 1983 with total page 103 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document records the activities and presents the findings of the Electronic Packaging and Interconnect Technology Working Group part of the IDA/OSD Reliability and Maintainability Study, conducted during the period from July 1982 through August 1983.
