Book of Donmon Teith

Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit boar

Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printe

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design method

This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip

Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest informat