Book of Donmon Teith

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding a

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the mos

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applica

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building