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Mechanics of Solder Alloy Interconnects
Language: en
Pages: 434
Authors: Darrel R. Frear
Categories: Computers
Type: BOOK - Published: 1994-01-31 - Publisher: Springer Science & Business Media

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The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as
The Mechanics of Solder Alloy Interconnects
Language: en
Pages: 0
Authors:
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Fundamentals of Lead-Free Solder Interconnect Technology
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mech
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
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This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under
Lead-Free Solder Interconnect Reliability
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