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Language: en
Pages: 423
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Type: BOOK - Published: 2015-12-09 - Publisher: Springer
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then pr
Language: en
Pages: 798
Pages: 798
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
Language: en
Pages: 484
Pages: 484
Type: BOOK - Published: 2014-04-22 - Publisher: John Wiley & Sons
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate d
Language: en
Pages: 211
Pages: 211
Type: BOOK - Published: 2018-04-17 - Publisher: CRC Press
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int
Language: en
Pages: 481
Pages: 481
Type: BOOK - Published: 2015-07-06 - Publisher: McGraw Hill Professional
A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for inc
