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Three-Dimensional Wafer Scale Integration for Ultra-Large-Scale Neuromorphic Systems
Language: en
Pages: 84
Authors: Zhe Wan
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Type: BOOK - Published: 2017 - Publisher:

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Recent trends indicate that we will generate exponentially more data from a variety of devices. Neuromorphic computing (a.k.a. brain-inspired computing), is req
NANO-CHIPS 2030
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In this book, a global team of experts from academia, research institutes and industry presents their vision on how new nano-chip architectures will enable the
3D Integration for VLSI Systems
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Pages: 376
Authors: Chuan Seng Tan
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Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press

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Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling
Driving Scientific and Engineering Discoveries Through the Convergence of HPC, Big Data and AI
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This book constitutes the revised selected papers of the 17th Smoky Mountains Computational Sciences and Engineering Conference, SMC 2020, held in Oak Ridge, TN
3D Integration in VLSI Circuits
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Authors: Katsuyuki Sakuma
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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int