Book of Donmon Teith

Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of wor

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the proces

For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the pr

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third