Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics

Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics
Author :
Publisher :
Total Pages : 344
Release :
ISBN-10 : 0780398068
ISBN-13 : 9780780398061
Rating : 4/5 (061 Downloads)

Book Synopsis Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics by : Leo J. Ernst

Download or read book Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics written by Leo J. Ernst and published by . This book was released on 2001 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics Related Books

Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics
Language: en
Pages: 344
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Language: en
Pages: 192
Authors: G.Q. Zhang
Categories: Technology & Engineering
Type: BOOK - Published: 2013-04-26 - Publisher: Springer

DOWNLOAD EBOOK

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Language: en
Pages: 195
Authors: G.Q. Zhang
Categories: Technology & Engineering
Type: BOOK - Published: 2013-06-29 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For
Power Electronic Packaging
Language: en
Pages: 606
Authors: Yong Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-15 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe
Physical Assurance
Language: en
Pages: 193
Authors: Navid Asadizanjani
Categories: Technology & Engineering
Type: BOOK - Published: 2021-02-15 - Publisher: Springer Nature

DOWNLOAD EBOOK

This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principle