Semiconductor Wafer Bonding

Semiconductor Wafer Bonding
Author :
Publisher :
Total Pages : 225
Release :
ISBN-10 : 1713819368
ISBN-13 : 9781713819363
Rating : 4/5 (363 Downloads)
DOWNLOAD EBOOK
Book Synopsis Semiconductor Wafer Bonding by : R. Knechtel

Download or read book Semiconductor Wafer Bonding written by R. Knechtel and published by . This book was released on 2020 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Semiconductor Wafer Bonding Related Books

Semiconductor Wafer Bonding
Language: en
Pages: 225

Semiconductor Wafer Bonding

Authors: R. Knechtel
Categories:
Type: BOOK - Published: 2020 - Publisher:

DOWNLOAD EBOOK

Semiconductor Wafer Bonding 9: Science, Technology, and Applications
Language: en
Pages: 398

Semiconductor Wafer Bonding 9: Science, Technology, and Applications

Authors: Helmut Baumgart
Categories: Microelectromechanical systems
Type: BOOK - Published: 2006 - Publisher: The Electrochemical Society

DOWNLOAD EBOOK

This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding T
Wafer Bonding
Language: en
Pages: 510

Wafer Bonding

Authors: Marin Alexe
Categories: Science
Type: BOOK - Published: 2013-03-09 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Language: en
Pages: 496

Semiconductor Wafer Bonding : Science, Technology, and Applications V

Authors: Charles E. Hunt
Categories: Technology & Engineering
Type: BOOK - Published: 2001 - Publisher: The Electrochemical Society

DOWNLOAD EBOOK

Handbook of Wafer Bonding
Language: en
Pages: 435

Handbook of Wafer Bonding

Authors: Peter Ramm
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-13 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding a